Semi-Automatic Single Spindle Grinder
IVG-2020/3020
This semi-automatic single spindle grinder is suitable for grinding 2鈥?12鈥 wafers and materials to special specifications. In addition to manual loading, simple operations, and abundant functions, the machine is equipped with an automatic thickness measurement and compensation system to improve grinding accuracy. The operations surface can be customized according to customer requirements, achieving excellent results across a wide range of applications.
Maximum Wafer Size8 inch
Grinding Wheel Specification脴203(OD)mm
Grinding Wheel Spindle Power6.0 kw