About TSD
Who is TSD
TSD focuses on research and development, production, and sales of ultra-precision surface processing equipment in the field of semiconductors.
Beijing TSD Semiconductor Equipment Co., it is a national high-tech enterprise with independent intellectual property rights, focusing on R&D, production and sales of ultra-precision plane processing equipment in the semiconductor field. With the mission of "Leading the Progress of Semiconductor Technology, Assisting Customers to Develop ", we are committed to become a global leading technology manufacturer of semiconductor equipment.
What Can We Do
What Can We Do
TSD is guided by flatter, thinner and more reliable technology, is deeply engaged in ultra-precision plane processing technology in semiconductor substrate material, wafer fabrication, semiconductor device, advanced packaging, MEMS, etc., forms the core technology advantage of leading technology, superior performance and stable process, and can provide system solutions and process equipment for thinning, polishing and CMP.
Polisher CMP Grinder
Polisher
CMP
Grinder
History
2024
B+ Round of Financing & In-depth Development
  • Won the title of鈥渘ational specialized,unique and new small giant enterprise鈥?amp;鈥淐hinese (potential) unicorn enterprise鈥
  • Successfully launched 8鈥 silicon carbide substrate grinding and polishing full-line equipment and 8鈥 silicon carbide wafer grinder
  • Established the Langfang Branch
  • Completed B+ round of financing
2023
Series B Financing & Establishment of branch office
  • Won the Beijing special new small and medium-sized enterprise, Beijing intellectual property pilot unit,
  • Post-doctoral research workstation identification
  • Successfully released TFG series automatic grinder, TPC series automatic chemical mechanical polisher,
  • TSC series wafer scrubber and TGP series diamond polisher
  • Set up branchs in Wuxi, Shenzhen
  • Completed Series B financing
2022
Strategic financing & moving the Company to a new location
  • Strategic investment reached with Shenzhen Hubble and the first round of investment with Anxin and Hongtai
  • Successfully launched TDL and TDP series double-sided grinding and polishing equipment
  • Able to provide silicon carbide substrate grinding and polishing line equipment
  • Established the Langtour Laboratory and Excelsior Laboratory
  • Moved the Company to Scientific Entrepreneurship Chip Park No.1
2021
Increase R&D investment & develop the business rapidly
  • Awarded as a national high-tech enterprise
  • Successfully launched TAP series single-sided polishing equipment to enrich the product line
  • Able to meet diversified market demands
2020
Accelerate equipment R&D & expand the business comprehensively
  • Established the TSD Semiconductor Company with a focus on the semiconductor industry
  • Successfully launched TSP series single-sided polishing machine
  • IVG series grinder
2014-2020
Accumulate technology & build a product system
  • Independent research and development have been built up over 6 years锛孍stablished the three major product systems of thinning, polishing, and CMP
Brand Culture