Automatic Single Spindle Grinder
IVG-2040/3040
This fully-automatic single spindle grinder is suitable for grinding 4鈥?12鈥 wafers. The machine is equipped to load and unload wafers, and it is integrated with automatic centering, cleaning, and drying functions. This machine is also equipped with an automatic thickness measurement and compensation system. It can realize automatic grinding processing of wafers from cassette to cassette, and complete dry-in and dry-out processing.
Maximum Wafer Size8 inch
Grinding Wheel Specification脴203(OD)mm
Grinding Wheel Spindle Power6.0 kw