Wafer Scrubber
TSC-100/300S
This series comprises special cleaning equipment for wafers after CMP, with a single-station single-chamber design. These machines can integrate PVA scrubbing, mega-sonic cleaning, N2 blow drying, high-speed spin drying, and other functions with a high degree of integration, and are suitable for cleaning various semiconductor wafers after CMP.
ProcessSingle-sided cleaning
Cleaning StationSingle-lumen single station
Upper And Lower PieceManual
Wafer Size2-6 inch