Wafer Scrubber
TSC-150C/200C/200L
This series comprises special cleaning machines for wafers after polishing. They integrate automatic loading and unloading systems, double-sided PVA scrubbing, mega-sonic cleaning, spin drying & N2 blow drying, and other units. They also enable wet/dry-in and dry-out functions, and are suitable for cleaning various semiconductor wafers after polishing.
Cleaning StationBelt transfer type 6 station
Wafer Size3-6 inch
Scrub Station *22 PVA brushes, double-sided cleaning