Solid Wax Bonder
TWB-1150S
This is a high-precision semi-automatic solid wax chip mounter with manual chip placement, automatic wax dripping, automatic chip picking alignment & placement, and automatic air bag pressurization. It also has slide heating, hot pressing and cooling functions, resulting in uniform wax layers and outstanding wax-pasting effects.
Wafer Size2/4 inch
Maximum Ceramic Plate SizeOD150 mm
Mode Of OperationSemi-automatic
Wax CoatingSolid wax in a wax can for dripping